Food Processing Plant Requirements
Must withstand daily high-pressure water and chemical cleaning
Dust Isolation Requirement：Complete isolation from flour and powder particles
Enclosed Thermal Management：Effective heat dissipation in protective enclosure
Corrosion Resistance：Resistance to acidic and alkaline cleaning agents
Hygienic Design
TouchWo Solution
DM101 Embedded in Custom 304 Stainless Steel Enclosure
Ensures entire system meets IP69K dust/water protection rating.
Thermal Management System
Industrial fanless motherboard with built-in thermal silicone paste for heat conduction, coupled with raised heat dissipation fins on rear housing.
High-Sensitivity Capacitive Touchscreen
Guarantees normal touch operation with water exposure or gloves.
